AiHua Liang

PCB Engineer

Email：liangaihua@@gdiist.cn

Personal Profile:

She graduated from Jiangmen Wuyi University in 2000. From 2001 to 2022, he worked at Xunxin Electronic Technology (Zhongshan) Co., Ltd. Engaged in semiconductor package design and IC substrate design. Understand the packaging process, process capabilities, and industry requirements of various modules. Familiar with the process flow, design process and requirements of PCB boards, IC substrates and flexible boards, and conductive frames. The designed products include MEMS module, PA module, ALS module, Fingerprint, CMMB module, Micro SD, SD card. The package types are QFN, LGA, CSP, BGA.

In September 2022, she served as a PCB engineer in the research group of Zheng Lirong of Guangdong Institute of Intelligent Science and Technology.

Selected Publications:

Circuit board structure and manufacturing method for preventing metal soldering pads from being scratched, CN104135815B