HaoMing Chu
Postdoctoral
Email：chuhaoming@@gdiist.cn
Research Interests:
Brain-like chips and intelligent systems
Personal Profile:
He received his bachelor's degree in electronic information science and technology from the School of Information Science and Engineering of Fudan University in 2016 and his Ph.D. in microelectronics and solid-state electronics from Fudan University in 2023. During the doctoral period, he carried out research on brain-inspired chips and intelligent systems, participated in many projects such as the National Natural Science Foundation of China and Shanghai Major Special Projects, including high-efficiency brain-inspired computing architecture, low-power brain-inspired computing ASIC special chips, efficient training and optimization methods of spiking neural networks, etc., and published more than 10 academic papers and applied for 3 invention patents.
Representative publications:
[1] H. Chu, Y. Yan, L. Gan, H. Jia, L. Qian, Y. Huan, L. Zheng and Z. Zou, "A Neuromorphic Processing System with Spike-Driven SNN Processor for Wearable ECG Classification", IEEE Transactions on Biomedical Circuits and Systems, 2022, 16(4): 511-523.
[2] H. Chu, H. Jia, Y. Yan, Y. Jin, L. Qian, L. Gan, Y. Huan, L. Zheng and Z. Zou, "A Neuromorphic Processing System for Low-Power Wearable ECG Classification", 2021 IEEE Biomedical Circuits and Systems Conference (BioCAS). IEEE, 2021: 1-5.
[3] H. Chu, Y. Huan, D. Bao, B. Källbäck, Y. Qin, Z. Zou and L. Zheng, "An ASIC Design of Multi-Electrode Digital Basket Catheter Systems with Reconfigurable Compressed Sampling", 2018 31st IEEE International System-on-Chip Conference (SOCC). IEEE, 2018: 124-129.
[4] H. Chu, Y. Yan, Y. Zhou, Z. Zhu, Y. Huan, L. Zheng and Z. Zou, "An Energy-Efficient and Robust SNN Classifier for LC-ADC sampled ECG Signals", 2023 8th International Conference on Integrated Circuits and Microsystems (ICICM). IEEE, 2023.
[5] B. Huang, Y. Huan, H. Chu, J. Xu, L. Liu, L. Zheng and Z. Zou, "IECA: An in-execution configuration CNN accelerator with 30.55 GOPS/mm2 area efficiency", IEEE Transactions on Circuits and Systems I: Regular Papers, 2021, 68(11): 4672-4685.
